Engineer Thermal Simulation PCB & Package(Hea Job/ 46)

Main tasks:

1. Execution of thermal simulations for the characterization and verification / design approval of semiconductor packages and systems
2. Carry-out thermal system simulations based on customer requests
3. Generation of 3D package models (STEP files) to carry out thermal simulations at the customer

Candidate profile:

1. A degree in electrical engineering, mechatronics, physics or a comparable education
2. Min. 3-5 years of experience in thermal simulation of Printed Circuit Boards (PCBs) and packages
3. Knowledge of different package technologies (lead frame, BGA, FCIP…)
4. Solid working experience with the simulation tool Ansys Icepak
5. Self-organized and independent working style
6. Very good English language skills